About Us
About Vexera Lab
Advanced ceramic substrate support for high-power semiconductor packaging and thermal management applications.
Vexera Lab supports engineering teams working with advanced ceramic substrates for laser diode packaging, GaN power electronics, SiC power modules, RF & microwave packaging and UV LED modules.
We focus on AlN, Si₃N₄ and Al₂O₃ ceramic substrates, with DPC, DBC and AMB process routes selected according to thermal performance, copper thickness, insulation requirements, reliability needs and manufacturability.
Our work starts before quotation. We help review drawings, stack-ups and application requirements, then provide practical feedback for material selection, process route selection, prototype builds and RFQ preparation.
Operational Highlights
Ceramic Materials
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Process Routes
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Application Areas
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Ceramic Substrate Focus
Focused on AlN, Si₃N₄ and Al₂O₃ substrates for high-power, high-reliability electronic packaging applications.
DPC / DBC / AMB Support
Process route guidance based on copper thickness, thermal path, insulation requirements and application conditions.
Prototype to RFQ
Support for early design review, manufacturability feedback, prototype builds and technical quotation preparation.