Technology

Technology

Core Technical Specifications

AMB Capabilities

ItemSpecification
MaterialSilicon Nitride (Si₃N₄), Aluminum Nitride (AlN)
Substrate Thickness0.38mm to 3.0mm
Layer CountSingle/Double‑sided Single Layer
Copper Thickness70µm – 800µm
Surface FinishOSP, ImAg, ENIG, ENEPIG, Gold/Silver Plating
Min. Conductor Spacing0.3mm
Min. Drill Diameter0.06mm
Hole & Outline Tolerance±0.05mm
Min. Trace‑to‑Edge Distance0.1mm
Thickness ToleranceTight control from ±0.01mm to ±0.05mm depending on dimensions

DPC Capabilities

Technical Parameters Standard Capabilities Advanced / Special Capabilities
Substrate Material Alumina (Al2O3), Aluminum Nitride (AlN) Silicon Nitride (Si3N4), Quartz Glass
Maximum Delivery Size Within 138 x 190 mm Up to 400 x 500 mm
Thickness Range 0.38 – 2.0 mm 0.127 – 10.0 mm
Thickness Tolerance ± 0.05 mm ± 0.01 mm
Material Brands Maruwa, Kyocera, Huaqing, Three-Circle Maruwa, Kyocera, Huaqing, Three-Circle
Raw Substrate Size 120 x 120 mm, 140 x 140 mm 200 x 200 mm
Copper Layer Thickness 30 – 300 μm 5 – 500 μm
Min. Line Width / Spacing 0.1 mm 0.03 mm
Min. Drill Hole Diameter 0.1 mm 0.05 mm
Surface Finish ENIG, ENEPIG, Immersion Silver, OSP, Immersion Tin ENIG, ENEPIG, Immersion Silver, OSP, Immersion Tin
Outline Tolerance ± 0.05 mm ± 0.02 mm

 

DBC Capabilities

Technical Parameters Manufacturing Capabilities
Substrate Material Alumina (Al2O3), Aluminum Nitride (AlN), ZTA (Zirconia Toughened Alumina)
Substrate Thickness 0.32 mm / 0.38 mm / 0.5 mm / 0.635 mm / 1.0 mm / 2.0 mm
Layer Count Single-sided Single-layer / Double-sided Single-layer
Copper Layer Thickness 100 – 400 μm / 500 – 800 μm
Surface Finish OSP, Immersion Silver, ENIG, ENEPIG
Min. Line Width / Spacing Line Width ≥ 0.5 mm / Line Spacing ≥ 0.4 mm
Min. Drill Hole Diameter 0.06 mm (Via Hole)
Finished Hole Size Tolerance Non-plated Through Hole (NPTH): ± 0.05 mm
Outline Tolerance ± 0.05 mm
Min. Distance (Trace to Edge) 0.10 mm
Finished Thickness Tolerance

– Thickness 0.32 – 0.38 mm: ± 0.03 mm


– Thickness 0.38 – 0.635 mm: ± 0.04 mm


– Thickness 1.0 – 2.00 mm: ± 0.05 mm

 

Discuss Your Ceramic Substrate Requirements